书目

集成电路封装材料的表征

内容简介

《集成电路封装材料的表征(英文)》的主要内容包括：Foreword；PrefacetotheReissueoftheMaterialsCharacterizationSeriesxiii；PrefacetoSeriesxiv；PrefacetotheReissueofIntegratedCircuitPackagingMaterialsxv；Prefacexvi；Contributorsxix等。

作者简介

ThomasM.MooreandRobertG.McKennaForewordbyWalterH.Schroen，TIFELLOWCharacterizationofIntegratedCircuitPackagingMaterialsdealswiththesystemsofmaterialsthatcompriseICpackages.ChaptersinthisvolumeaddressimportantcharacteristicsofICpackages.ItdemonstratesanalyticaltechniquesappropriateforICpackagecharacterizationthroughexamplesofthemeasurementofcriticalperformanceparametersandtheanalysisofkeytechnologicalproblemsofICpackages.Thisbookdiscussesissueswhichaffectavarietyofpackagetypes，includingplasticsurface—mountpackages，hermeticpackages，andadvanceddesignssuchasflip—chip，chip—on—board，andmulti—chipmodels.

目录

丛书

材料表征原版系列丛书

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