WIRE BONDING IN MICROELECTRONICS SET2 3E

TheIndustryStandardGuidetoWireBonding--FullyUpdatedThedefinitiveresourceonthecriticalprocessofconnectingsemiconductorswiththeirpackages."WireBondinginMicroelectronics,"ThirdEdition,hasbeenthoroughlyrevisedtohelpyoumeetthechallengesoftoday'ssmall-scaleandfine-pitchmicroelectronics.Thisauthoritativeguidecoverseveryaspectofdesigning,manufacturing,andevaluatingwirebondsengineeredwithcutting-edgetechniques.Inadditiontogainingafullgraspofbondingtechnology,you'lllearnhowtocreatereliablebondsatexceedinglyhighyields,testwirebonds,solvecommonbondingproblems,implementmolecularcleaningmethods,andmuchmore.COVERAGEINCLUDES:Ultrasonicbondingsystemsandtechnologies,includinghigh-frequencysystemsBondingwiremetallurgyandcharacteristics,includingcopperwireWirebondtestingGold-aluminumintermetalliccompoundsandotherinterfacereactionsGoldandnickel-basedbondpadplatingmaterialsandproblemsCleaningtoimprovebondabilityandreliabilityMechanicalproblemsinwirebondingHigh-yield,fine-pitch,specialized-looping,soft-substrate,andextreme-temperaturewirebondsCopper,low-dielectric-constant(Cu/Lo-k)technologyandproblemsWirebondingprocessmodelingandsimulationCDincludesallofthebook'sfull-colorfiguresplusanimations.